Our ChemetriQ® inspection systems enable fabs to improve yield by detecting
Non-Visual Defects (NVD), sub-monolayer metallic and organic contamination,
and other yield-killing surface non-uniformities that cannot be seen by optical
Applying leading-edge non-visual defect inspection to a mainstream 200mm fab
Non-Visual Defect Inspection: The Tech of Tomorrow?
Collaborate or Go Home
Characterization and Optimization of a TSV CMP Reveal Process using a Novel Wafer Inspection Technique for Detecting Sub-Monolayer Surface Contamination
IEEE Transactions on Semiconductor Manufacturing, Vol 26, Number 3
Detection and Elimination of a Yield-Critical Non-Visual Residue Defect
Detection and Elimination of a Yield Critical Non-Visual Residue Defect at Gate Module Etch and Clean Process
Impact of Charge During Gate Oxide Patterning on Yield
Resist Charge to Oxide Pitting
April 22-24, 2014, Austin, Texas
The SEMATECH Surface Preparation and Cleaning Conference (SPCC) is an annual event which brings together prominent researchers from the semiconductor industry and the university community to focus on the current developments and ITRS challenges in advanced wafer and mask cleaning and surface preparation technologies for the 16nm node and beyond.