Qcept Technologies is the world leader in Non-Visual Defect (NVD) inspection.

Our ChemetriQ® inspection systems enable fabs to improve yield by detecting Non-Visual Defects (NVD), sub-monolayer metallic and organic contamination, and other yield-killing surface non-uniformities that cannot be seen by optical tools.

August 2008

Solid State Technology -Taiwan

"Full-Wafer Post-Via Wet Clean Non-Visual Defect Inspection"

Contributors- Dana Scranton, Jim Bryer, Semitool, Kalispell, MT USS and Robert Newcomb and Bill Usry of Qcept Technologies.

July 2008

Solid State Technology

"Qcept gets a visual on defects "

by Debra Vogler

Video interview with Erik C. Smith, Qcept President & COO, at MCA press reception, SEMICON West 2008.

July 2008

WaferNEWS, Solid State Technology

"Charge Signature Flags Non-Visual Defects"

by Kathryn Derbyshire

Interview with Erik C. Smith, Qcept President & COO, at SEMICON West 2008.

July 2008

EE Times

"Video:  Qcept says startups can survive downturn"

by Mark LePedus

Video interview of Erik C. Smith at SEMICON West 2008 addressing NVDs, inspection and metrology.

June 2008

Semiconductor International

"SEMICON West 2008 Executive Outlook "
Qcept President & COO, Erik Smith, comments on key measures to success in today's semiconductor industry.

May 2008

EE Times-Europe

"CEA-Leti, Qcept partner on semi process development"
by Anne Francoise-Pele

Adrien Danel, lead research engineer at Leti, speaks about the partnership between Qcept and CEA-Leti to investigate techniques for characterizing leading-edge semiconductor materials and processes such as high-k and low-k dielectrics, atomic layer deposition (ALD), fully silicided (FUSI) metal gates and advanced cleaning technologies.

April 2008

Semiconductor International

"The Donut Mystery"
by David Lammers

Blog covering John Halladay's presentation at SPCC 2008.  Topic:  Qcept's ChemetriQ® 3000 results for Spansion's Fab 25.

April 2008
Solid State Technology
"Full-Wafer Post-Via Wet Clean Non-Visual Defect Inspection"
Contributors- Dana Scranton, Jim Bryer, Semitool, Kalispell, MT USS and Robert Newcomb and Bill Usry of Qcept Technologies.

April 2008
SPCC 2008- Austin, TX
"Elimination of ESD Defects Using DICO2"
Contributors- John Halladay, Joohwan Yoo, Kinsang Lam, Jeremy Lansford and Bill Brennan of Spansion Fab 25, Barbara Teeter of SEZ America, Robert Newcomb and Bill Usry of Qcept Technologies.

April 2008

SPCC 2008- Austin, TX
"Imaging of Contamination on Wafers Using a Scanning Surface Potential Difference Measurement Technique"
Contributors- A. Danel, J.P. Barnes, S. Sage of CEA-LETI, MINATEC, R. Bryant,

R. Newcomb and R. Spicer of Qcept Technologies

April 2008
SPCC 2008- Austin, TX
"Optimization of a Post Via Etch Wet Clean Process Using a Novel, Full-Wafer Inspection Technique for Non-Visual Defects"
Contributors - Dana Scranton and Jim Byer of Semitool, Robert Newcomb and Bill Usry of Qcept Technologies Inc.

January 2008
Semiconductor International
Executive Outlook: "Driving Productivity"
Contributor - Erik Smith, President & COO, Qcept Technologies Inc.

 

SEMATECH Surface Preparation and Cleaning Conference (SPCC)

March 23-25, 2009

Austin, TX

SEMICON West 2009

July 14-16, 2009

San Francisco, CA

Visit us in Booth 947

 

 

 

 

 

 

Qcept's ChemetriQ® Series Wafer Inspection Systems
Introducing the new family of inspection systems. Whether you’re in a high-volume, advanced fab, in pilot production, development or a research lab, there's a ChemetriQ tool that will enable you to improve yield and increase fab profitability.

             

May 28, 2008
Qcept Technologies Teams with CEA-LETI on Advanced Semiconductor Process Development

March 3, 2008
Qcept Secures $9.5 Million in Series C Funding