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SPCC 2013 Detection and Elimination of a Yield Critical Non-Visual Residue Defect at Gate Module Etch and Clean Process March 2013 October 2012 Electrochemical Induced Pitting Defects at Gate Oxide Patterning July 2012 Impact of Charge During Gate Oxide Patterning on Yield By Jungtae Park, Sungjin Cho, Jeffrey Hawthorne October 2011 Semiconductor Manufacturing; & Design "Non-visual defect inspection gives fabs better eyes, new insights" by Katherine Derbyshire July 2011 Semicon West March 2011 ElectroIQ March 2011 FabTech "Tool Order: Two Leading IC Manufacturers Select Qcept's Non-Visual Defect Inspection System" by Mark Osborne July 2010 ElectroIQ Blog (Solid State Technology) "Qcept Technology for Detecting Submonolayer Non-Visual (NVD) Defects on Semiconductor Wafers" Debra Vogler of Solid State Technology podcast with Ralph Spicer, Qcept Technologies July 2010 R&D Magazine Next-generation NVD Inspection Solution for Patterned Wafers. July 2010 PC's Semiconductors Blog Qcept Technologies Intros Next-Generation NVD Inspection Solution for Patterned Wafers. October 2009 EuroAsia Semiconductor Issue VI 2009 "New Eyes for Advanced Processes," by R. Spicer of Qcept Technologies August 2009 Semiconductor International "Defect Detection Drives to Greater Depths" by R. DeJule, Contributing Editor -- Semiconductor International August 2009 Solid-State Technology "Non-visual Defect Inspection for Comprehensive Yield Management " by R. Spicer of Qcept Technologies June 2009 ASMC 2009 by R. Schuetten, M. Kleber, M. Jerenz, I. Gregorius, B. Zimmermann, R. Kaesmaier, of Qimonda Dresden GmbH & Co OHG; R. Newcomb, J. Hickson, N. Tamayo of Qcept Technologies June 2009 ASMC 2009 "Novel In-line Inspection Method for Non-visual Defects and Charging " by K. Hoppner, R. Manuwald, T. Fahr, E. Zschech of Advanced Micro Devices; J. Hickson, N. Tamayo, R. Newcomb of Qcept Technologies
March 2009 SPCC 2009 - Austin "Optimization of Edge Clean Using Non-visual Defect Inspection " by L. Gabette, A. Danel of CEA-LETI, MINATEC, P. Besson of ST Microelectronics, R. Spicer, B. Usry, D. Peters, R. Newcomb of Qcept Technologies
March 2009 Fabtech "Qcept Technologies' NVD Inspection Solution to be Evaluated by Top Memory Manufacturer " by Jon Haines
January 2009 WaferNEWS "Yield Management Strategies Need to Keep Pace with Semiconductor Innovation" by Erik C. Smith, President of Qcept Technologies
December 2008 Fabtech "Soitec Adopts Qcept Technologies' NVD ChemetriQ" by Syanne Olson
August 2008 Solid State Technology-Taiwan "Full-Wafer Post-Via Wet Clean Non-Visual Defect Inspection" Contributors- D. Scranton, J. Bryer, Semitool, Kalispell, MT and R. Newcomb and B. Usry of Qcept Technologies
July 2008 Solid State Technology "Qcept gets a visual on defects " by Debra Vogler Video interview with Erik C. Smith, Qcept President & COO, at MCA press reception, SEMICON West 2008
July 2008 WaferNEWS, Solid State Technology "Charge Signature Flags Non-Visual Defects " Interview with Erik C. Smith, Qcept President & COO, at SEMICON West 2008
July 2008 EE Times "Video: Qcept says startups can survive downturn" by Mark LePedus Video interview of Erik C. Smith at SEMICON West 2008 addressing NVDs, inspection and metrology
June 2008 Semiconductor International "SEMICON West 2008 Executive Outlook "
May 2008 EE Times-Europe "CEA-Leti, Qcept partner on semi process development" Adrien Danel, lead research engineer at Leti, speaks about the partnership between Qcept and CEA-Leti to investigate techniques for characterizing leading-edge semiconductor materials and processes such as high-k and low-k dielectrics, atomic layer deposition (ALD), fully silicided (FUSI) metal gates and advanced cleaning technologies.
April 2008 Semiconductor International "The Donut Mystery" Blog covering John Halladay's presentation of Qcept's ChemetriQ® 3000 results for Spansion's Fab 25 at SPCC 2008
April 2008
April 2008
April 2008 SPCC 2008- Austin, TX R. Newcomb and R. Spicer of Qcept Technologies
April 2008
January 2008
May 2005
Jan/Feb 2005 "Inspecting Wafers Using a Potential Difference Imaging Sensor Method" Contributors - Chris Yang, Jeff Hawthorne, Brandon Steele, Robert Bryant of Qcept Technologies Inc., David Sowell of Intellimetrics, David Maloney and Katy Ip of DuPont/EKC Technology.
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