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SPCC 2013 Detection and Elimination of a Yield Critical Non-Visual Residue Defect at Gate Module Etch and Clean Process October 2012 Electrochemical Induced Pitting Defects at Gate Oxide Patterning By Jungtae Park, Wiseok Kang, Pilwoong Bang, Taewoong Hwang, Samsung Electronics Co., Ltd Sungjin Cho, Jaeyoung You, Jeff Hawthorne, Qcept Technologies Inc. SPCC 2012 Resist Charge to Oxide Pitting October 2010 The Seventh International Surface Cleaning Workshop March 2010 SEMATECH Surface Preparation and Cleaning Conference "Charge-Induced Attraction of Particles in Surface Preparation and Clean Processes" by Y. Yamada, H. Eda, M. Kodera, M. Tamaoki, A. Shimazaki of Toshiba Corporation; W. Usry, R. Newcomb of Qcept Technologies October 2009 EuroAsia Semiconductor Issue VI 2009 "New Eyes for Advanced Processes," Issue VI 2009: 19-22 by R. Spicer of Qcept Technologies August 2009 Solid-State Technology "Non-visual Defect Inspection for Comprehensive Yield Management " by R. Spicer of Qcept Technologies August 2009 Semiconductor International "Defect Detection Drives to Greater Depths" by Ruth DeJule, Contributing Editor -- Semiconductor International June 2009 ASMC 2009 "A New Surface Analysis Method for Semiconductor Manufacturing based on Surface-Potential by R. Schuetten, M. Kleber, M. Jerenz, I. Gregorius, B. Zimmermann, R. Kaesmaier, of Qimonda Dresden GmbH & Co OHG; R. Newcomb, J. Hickson, N. Tamayo of Qcept Technologies June 2009 ASMC 2009 "Novel In-line Inspection Method for Non-visual Defects and Charging " by K. Hoppner, R. Manuwald, T. Fahr, E. Zschech of Advanced Micro Devices; J. Hickson, N. Tamayo, R. Newcomb of Qcept Technologies May 2009 Frontiers of Characterization and Metrology for Nanoelectronics - Albany, NY "VOC & Metallic Contaminant Control For by R. Brun, C. Moulin, C. Girard of Soitec and March 2009 SPCC 2009 - Austin, TX "Optimization of Edge Clean Using Non-visual Defect Inspection " by L. Gabette and A. Danel of CEA-LETI, Minatec, P. Besson of ST Microelectronics, R. Spicer, B. Usry, D. Peters, R. Newcomb of Qcept Technologies March 2009 Semiconductor International "Controlling Process-Induced Charging Heightens Productivity" by R. Spicer, J. Hawthorne, D. Peters, R. Newcomb of Qcept Technologies April 2008 April 2008 SPCC 2008- Austin, TX April 2008 April 2008 "Full-Wafer Post-Via Wet Clean Non-Visual Defect Inspection" Contributors - D. Scranton, J. Bryer, Semitool, Inc., Kalispell, MT and R. Newcomb, B. Usry, Qcept Technologies October 2007 Advanced Substrate News September 2006 UCPSS 2006 Contributors- R. Bryant, J. Hawthorne, J. Hickson of Qcept Technologies February 2005 MICRO Magazine Contributors- D. Maloney and K. Ip of DuPont EKC Technology, D. Sowell of Intellimetrics, Inc. and C. Yang, J. Hawthorne, B. Steele, R. Bryant of Qcept Technologies |
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